Intel Becomes First to Ship High-Volume Chips Made With ASML High-NA EUV

Intel has become the first company to ship high-volume logic chips manufactured using ASML’s next-generation High-NA EUV lithography technology, marking a historic milestone in semiconductor production. The chips are select layers of the Intel Core Ultra Series 3 processors, codenamed Panther Lake, built on the company’s new Intel 18A (1.8nm-class) process node at its Oregon facility. While the technology is currently applied only to specific dual-qualified layers rather than the entire chip, the resulting processors are already shipping to customers with yields matching those of Intel’s existing EUV platform. This achievement validates that High-NA EUV can operate within a commercial logic manufacturing flow, positioning Intel ahead of competitors in the race to deploy 2nm-class technology at scale.