Intel ships first high-volume chips made with ASML High-NA EUV lithography

Intel has become the first company to ship high-volume logic chips manufactured using ASML’s cutting-edge High-NA EUV lithography technology, marking a historic milestone for the semiconductor industry. The chips are a subset of Intel Core Ultra Series 3 “Panther Lake” processors built on the Intel 18A process node at Intel’s Oregon facility, with yields matching those of existing EUV platforms ^[1][2][4]. This achievement demonstrates High-NA EUV’s readiness for production, enabling significantly smaller transistor features—up to 1.7 times smaller than current tools—and potentially doubling transistor density to power next-generation AI and mobile devices . The milestone also signals Intel’s resurgence as a manufacturing leader, stabilizing 18A yields between 60% and 65% while advancing its “five nodes in four years” strategy to compete with rivals .