Chips and hardwareUpdated November 3

Wccftech warns HBF could squeeze NAND supply if it takes off

HBF is a NAND-based memory layer between HBM and SSDs. Wccftech’s warning is about what happens if it succeeds commercially: an 8-Hi HBF stack uses 6.5 times the wafers of typical TLC NAND, which could tighten NAND supply and make cheaper SSDs harder to come by. SK hynix and Sandisk have unveiled HBF standard specifications, but Wccftech expects commercial rollout in 2028 or 2029. The cited Arabic report says the specification is not ready for mass production. It’s a possible future squeeze, not an explanation for today’s high prices.

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Coverage started November 3