Chips and hardwareUpdated November 9
Infineon turns 300mm SiC wafers into power devices.
At its Villach fab, Infineon says it has processed 300mm silicon-carbide wafers into functional power devices using existing silicon manufacturing equipment. It calls this the first such milestone in a full-scale semiconductor fab. A 300mm wafer offers 2.3 times more chips per wafer than a 200mm one, according to the company, which sees this as a step toward industrializing the technology. But this is a feasibility milestone, not the start of high-volume production. Infineon says customers and partners will help plan the 300mm technology and ramp timing, while its 200mm SiC manufacturing roadmap continues. The larger wafer has made functional devices; the production timetable is still something to work out together.
Coverage started November 9