Chips and hardwareUpdated 6h ago

Kao says TSMC can’t make 3D DRAM; another expert sees BEOL potential.

Charles Kao says TSMC “cannot do 3D DRAM,” pushing back on expectations that it will enter the memory business. Another semiconductor expert sees a different possibility: TSMC could develop a novel BEOL memory. That is a separate technical possibility, not confirmation of a 3D DRAM product. Both are expert assessments; the reported investment decision and mass-production schedule remain unsettled.

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Coverage started 6h ago